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NTD4815NH
Power MOSFET
30 V, 35 A, Single N--Channel, DPAK/IPAK
Features
?
Low R DS(on) to Minimize Conduction Losses
?
?
Low Capacitance to Minimize Driver Losses
Optimized Gate Charge to Minimize Switching Losses
http://onsemi.com
? Low R G
? These are Pb--Free Devices
Applications
? CPU Power Delivery
? DC--DC Converters
V (BR)DSS
30 V
R DS(ON) MAX
15 m Ω @ 10 V
27.7 m Ω @ 4.5 V
D
I D MAX
35 A
? High Side Switching
MAXIMUM RATINGS (T J = 25 ° C unless otherwise stated)
G
Parameter
Symbol
Value
Unit
Drain--to--Source Voltage
Gate--to--Source Voltage
V DSS
V GS
30
± 20
V
V
S
N--CHANNEL MOSFET
Continuous Drain
Current R θ JA
(Note 1)
T A = 25 ° C
T A = 85 ° C
I D
8.5
6.5
A
4
4
4
1 2
3
1
2 3
3
Power Dissipation
R θ JA (Note 1)
Continuous Drain
Current R θ JA
(Note 2)
Power Dissipation
R θ JA (Note 2)
Continuous Drain
Current R θ JC
(Note 1)
Steady
State
T A = 25 ° C
T A = 25 ° C
T A = 85 ° C
T A = 25 ° C
T C = 25 ° C
T C = 85 ° C
P D
ID
P D
I D
1.92
6.9
5.3
1.26
35
27
W
A
W
A
1
2
DPAK 3 IPAK IPAK
CASE 369AA CASE 369AC CASE 369D
(Bent Lead) (Straight Lead) (Straight Lead
STYLE 2 DPAK)
MARKING DIAGRAMS
Power Dissipation
R θ JC (Note 1)
Pulsed Drain
Current
t p =10 m s
T C = 25 ° C
T A = 25 ° C
P D
I DM
32.6
87
W
A
4
Drain
& PIN ASSIGNMENTS
4
Drain
4
Drain
Current Limited by Package
Operating Junction and Storage
Temperature
T A = 25 ° C
I DmaxPkg
T J ,
T STG
35
--55 to
+175
A
° C
1
2
3
Source Gate Drain Source
1
2
3
Source Current (Body Diode)
Drain to Source dV/dt
Single Pulse Drain--to--Source Avalanche
Energy (V DD = 24 V, V GS = 10 V,
I L = 15.4 A pk , L = 0.3 mH, R G = 25 Ω )
Lead Temperature for Soldering Purposes
(1/8” from case for 10 s)
I S
dV/dt
EAS
T L
27
6
35.6
260
A
V/ns
mJ
° C
2
1 Drain 3
Gate
Gate Drain Source
Y = Year
WW = Work Week
4815NH= Device Code
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
G = Pb--Free Package
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 6 of this data sheet.
? Semiconductor Components Industries, LLC, 2010
June, 2010 -- Rev. 3
1
Publication Order Number:
NTD4815NH/D
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